| Items |
Speci. |
| Max panel size |
32" x 20.5"(800mm x 520mm) |
| Min trace width/ space (inner layer) |
4mil/4mil(0.1mm/0.1mm) |
| Min PAD (inner layer) |
5 mil(0.13mm) |
| Min thickness(inner layer) |
4 mil(0.1mm) |
| Inner copper thickness |
1~4 oz |
| Outer copper thickness |
0.5~6 oz |
| Finished board thickness |
0.4-3.2 mm |
| Board thickness tolerance control |
±0.10 mm |
±0.10 mm |
| ±10% |
±10% |
| ±10% |
±10% |
| Inner layer treatment |
brown oxidation |
| Layer count Capability |
1-30 LAYER |
| alignment between ML |
±2mil |
| Min drilling |
0.15 mm |
| Min finished hole |
0.1 mm |
| Hole precision |
±2 mil(±50 um) |
| tolerance for Slot |
±3 mil(±75 um) |
| tolerance for PTH |
±3 mil(±75um) |
| tolerance for NPTH |
±2mil(±50um) |
| Max Aspect Ratio for PTH |
08:01 |
| Hole wall copper thickness |
15-50um |
| Alignment of outer layers |
4mil/4mil |
| Min trace width/space for outer layer |
4mil/4mil |
| Tolerance of Etching |
+/-10% |
| Thickness of solder mask |
on trace |
0.4-1.2mil(10-30um) |
| at trace corner |
≥0.2mil(5um) |
| On base material |
≤+1.2mil |
| Finished thickness |
| Hardness of solder mask |
6H |
| Alignment of solder mask film |
±2mil(+/-50um) |
| Min width of solder mask bridge |
4mil(100um) |
| Max hole with solder plug |
0.5mm |
| Surface finish |
HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. |
| Max Nickel thickness for Gold finger |
280u"(7um) |
| Max gold thickness for Gold finger |
30u"(0.75um) |
| Nickel thickness in Immersion Gold |
120u"/240u"(3um/6um) |
| Gold thickness in Immersion Gold |
2u"/6u"(0.05um/0.15um) |
| Impedance control and its tolerance |
50±10%,75±10%,100±10% 110±10% |
| Trace Anti-stripped strength |
≥61B/in(≥107g/mm) |
| bow and twist |
0.75% |
|
Double sided pcb board with osp finish:
Place of Origin Guangdong, China (Mainland)
Brand Name OKEY
Model Number okey pcb
Base Material FR-4
Copper Thickness 1 OZ
Board Thickness 1.2 mm
Min. Hole Size 0.4mm
Min. Line Width 0.2mm
Min. Line Spacing 0.15mm
Surface Finishing HASL
Color red
Small order acceptable
Fire resistanceUL-94V0
Outline/contourmilling, V-cut, CNC Routing
100% productsE-test or flying probe test
Features
Thin board capabilities
Increase routing density in complicated desig
Excellent mounting stability and reliability
Qualified material and surface treatment for Lead-free process
Applications
Smartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD Module
Benefits
Well experienced manufacturer with good yiel
Multiple plants increase production output in short time
| NO |
Item |
Technical capabilities |
| 1 |
Layers |
1-20 layers |
| 2 |
Max. Board size |
2000×610mm |
| 3 |
Min. board Thickness |
2-layer 0.15mm |
| 4-layer 0.4mm |
| 6-layer 0.6mm |
| 8-layer 1.5mm |
| 10-layer 1.6~2.0mm |
| 4 |
Min. line Width/Space |
0.1mm(4mil) |
| 5 |
Max. Copper thickness |
10OZ |
| 6 |
Min. S/M Pitch |
0.1mm(4mil) |
| 7 |
Min. hole size |
0.2mm(8mil) |
| 8 |
Hole dia. Tolerance (PTH) |
±0.05mm(2mil) |
| 9 |
Hole dia. Tolerance (NPTH) |
+0/-0.05mm(2mil) |
| 10 |
Hole position deviation |
±0.05mm(2mil) |
| 11 |
Outline tolerance |
±0.10mm(4mil) |
| 12 |
Twist & Bent |
0.75% |
| 13 |
Insulation Resistance |
>10 12 Ω Normal |
| 14 |
Electric strength |
>1.3kv/mm |
| 15 |
S/M abrasion |
>6H |
| 16 |
Thermal stress |
288°C 10Sec |
| 17 |
Test Voltage |
50-300V |
| 18 |
Min. blind/buried via |
0.15mm (6mil) |
| 19 |
Surface Finished |
HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 |
Materials |
FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
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