• Fr4 PCB with Gold Finger
  • Fr4 PCB with Gold Finger
  • Fr4 PCB with Gold Finger
  • Fr4 PCB with Gold Finger
  • Fr4 PCB with Gold Finger
  • Fr4 PCB with Gold Finger

Fr4 PCB with Gold Finger

Type: Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Samples:
US$ 0.5/Piece 1 Piece(Min.Order)
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Customization:

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Diamond Member Since 2013

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Manufacturer/Factory

Basic Info.

Model NO.
okey16
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Certificate
ISO UL RoHS and Reach
Small Order
Accept
Color
Green, Blue, Black, Red, Yellow etc.
Transport Package
Inner Vacuum Packing Outer Carton Box
Specification
FR 4, 1.6mm, 4 Layers, 1OZ Copper Thickness
Trademark
OKEY
Origin
Guangdong Shenzhen, China
HS Code
8534009000
Production Capacity
Output 20 000 Square Meter Per Month

Product Description

Technical Capabilities
Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)  
Max. Board size 2000×610mm  


Min. board Thickness
2-layer 0.15mm  
4-layer 0.4mm  
6-layer 0.6mm  
8-layer 1.5mm  
10-layer 1.6~2.0mm  
Min. line Width/Space 0.1mm(4mil)  
Max. Copper thickness 10OZ  
Min. S/M Pitch 0.1mm(4mil)  
Min. hole size 0.2mm(8mil)  
Hole dia. Tolerance (PTH) ±0.05mm(2mil)  
Hole dia. Tolerance ,+0/-0.05mm(2mil)  
Hole position deviation ±0.05mm(2mil)  
Outline tolerance ±0.10mm(4mil)  
Twist & Bent 0.75%  
Insulation Resistance >10 12 Ω Normal  
Electric strength >1.3kv/mm  
S/M abrasion >6H  
Thermal stress 288°C 10Sec  
Test Voltage 50-300V  
Min. blind/buried via 0.15mm (6mil)  

Surface Finished
HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold  

Materials
FR4,H-
TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
 
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control
±0.10 mm ±0.10 mm
1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1-30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  

Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger

Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger
Fr4 PCB with Gold Finger

FR4 PCB with gold finger

1. PCB layer: 4layers
2. PCB Certificate: ISO UL REACH and RoHS
3. FR-4 Material
4. Best price with excellent after-service
Our Printed Circuit Board Technical Capabilities

Our PCB sell well at Eurpe, America and Asia, passed UL ISO Certificates and meet RoHS, REACH standards. We have rich experience in PCB field to serve your needs.

Welcome to contact us for more details and talk further business.
Inquiries are typically answered within 24 hours.
Wish you all the best and prosperous business.
NO Item Technical capabilities
1 Layers 1-12 layers
2 Max. Board size 2000×610mm
3 Min. board Thickness 2-layer  0.25mm
4-layer  0.6mm
6-layer  0.8mm
8-layer  1.5mm
10-layer  1.6~2.0mm
4 Min. line Width/Space 0.15mm(4-5mil)
5 Max. Copper thickness 10OZ
6 Min. S/M Pitch 0.15mm(4-5mil)
7 Min. hole size 0.2mm(8mil)
8 Hole dia. Tolerance (PTH) ±0.05mm(2mil)
9 Hole dia. Tolerance (NPTH) +0/-0.05mm(2mil)
10 Hole position deviation ±0.05mm(2mil)
11 Outline tolerance ±0.10mm(4mil)
12 Twist & Bent 0.75%
13 Insulation Resistance >10 12 Ω Normal
14 Electric strength >1.3kv/mm
15 S/M abrasion >6H
16 Thermal stress 288°C10Sec
17 Test Voltage 50-300V
18 Min. blind/buried via 0.2mm  (8mil)
19 Surface Finished LF HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20 Materials FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base

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Diamond Member Since 2013

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Manufacturer/Factory
Registered Capital
2000000 RMB
Plant Area
>2000 square meters