Mobile Phone Motherboard Electronic Contract Manufacturing Customized Multilayer PCBA

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Model NO.: Okey-am-0523-01
• Base Material: Copper
• Insulation Materials: Organic Resin
• Model: PCB
• Brand: Okey
• Transport Package: Inner Vacumm Package, Outer Carton
• Specification: UL certified, Rohs Compliant
• Trademark: Okey
• Origin: Shenzhen, Guangdong
• HS Code: 8534009000
• Production Capacity: 20000 Square Meter Per Month

Product Description

Technical Capabilities
Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Max. Board size		2000×610mm
Min. board Thickness		2-layer 0.15mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
Min. line Width/Space		0.1mm(4mil)
Max. Copper thickness		10OZ
Min. S/M Pitch		0.1mm(4mil)
Min. hole size		0.2mm(8mil)
Hole dia. Tolerance (PTH)		±0.05mm(2mil)
Hole dia. Tolerance		,+0/-0.05mm(2mil)
Hole position deviation		±0.05mm(2mil)
Outline tolerance		±0.10mm(4mil)
Twist & Bent		0.75%
Insulation Resistance		>10 12 Ω Normal
Electric strength		>1.3kv/mm
S/M abrasion		>6H
Thermal stress		288°C 10Sec
Test Voltage		50-300V
Min. blind/buried via		0.15mm (6mil)
Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials		FR4,H- TG,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm

Specifications

PCB Board
1. Reputable manufacturer
2. Certificate: ISO UL RoHS REACH
3. FR-4 Material
4. Timely deliver

PCB board Manufacturer

Features

Suitable for BGA with smaller ball pitch and higher I/O counts
Thin board capabilities
Increase routing density in complicated design
Excellent mounting stability and reliability
Qualified material and surface treatment for Lead-free process

Applications

Smartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD Module

Benefits

1. We have 10 years experience in PRINTED CIRCUIT BOARD field to serve your needs
2. Competitive PRINTED CIRCUIT BOARD price with high quality
3. Excellent service and prompt delivery
4. Our PRINTED CIRCUIT BOARD get ISO and UL Certificates and meet RoHS, REACH standard

NO	ITEM	Technical capabilities
1	Layers	1-12 layers
2	Max. Board size	1500×610mm
3	Min. board Thickness	2-layer   0.25mm
		4-layer    0.4mm
		6-layer   0.6mm
		8-layer   1.5mm
		10-layer  1.6~2.0mm
4	Min. line Width/Space	0.15mm (4-5mil)
5	Max. Copper thickness	10OZ
6	Min. S/M Pitch	0.15mm(4-5mil)
7	Min. hole size	0.2mm (8mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	>10 12 Ω Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C 10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.15mm  (6mil)
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4,H-TG,Rogers,Ceramics,Aluminium, Copper base