PCB Assembly Electronic Component Bluetooth Speaker Schematic Diagram Circuit Board Manufacturer PCBA

• Metal Coating: Silver
• Mode of Production: SMT
• Layers: Multilayer
• Base Material: FR-6
• Certification: RoHS, CCC, ISO
• Customized: Customized
• Model NO.: OKEYPCBA-003
• Condition: New
• Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg
• Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG
• Layer: 1-60 Layers
• Service: Turnkey Assembly PCB Service
• Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui
• Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm
• Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole
• Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS
• Order Qty: No Limited
• Controlling Range: -40c~125c
• Solder Resist Color: Green;Red;Yellow;Black;White
• Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask
• Trade Mark: OEM, ODM
• Min. Line Width: 4mil
• Max Production Size: 600*800mm
• Transport Package: Inner Vacuum Packing Outer Carton Box
• Specification: FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
• Trademark: OKEY/ODM OEM
• Origin: China
• HS Code: 8534009000
• Production Capacity: Output 10 000 Square Meter Per Month

Product Description

Our one-stop service:
1. PCB development and design;
2. PCB manufacturing from 1 to 32 layers(Rigid PCB,Flexible PCB,Ceramci PCB,Aluminum PCB);
3. PCB Clone;
4. Component sourcing;
5. PCB Assembly;
6. Write program for customers;
7. PCB/ PCBA Test.
8. Contract Manufacturing  
9.  Engineering Services  
10. Component Procurement & Material Management  
11. Product Design  
12.Fast Track Prototyping  
13.Cable and Wire Assemblies
14.Plastics and Molds  
15.  Function Testing Service

Our Advantage: 
1. Free programming and free functional test, free package. 
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% funtional test. 
3. Professional service. ISO SMT and through hole assembly, over 12 years experience.
4. Certification for electronics: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001:2008, ISO14001.
5. 24 hours online service.

 

PCB Assembly Capability:

Stencil Size:	736x736mm
Minimum IC Pitch:	0.2mm
Maximum PCB size:	1200x 500mm
Minimum PCB thickness:	0.25mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Volume:	One piece to low volume production quantities Low cost first article builds Schedule deliveries
Assembly type:	Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly
Components type:	Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Parts procurements:	Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder type:	Leaded Lead-free/ROHS compliant
Other capabilities:	Repair/rework services Mechanical assembly Box build Mold and plastic injection.

Our Cooperative Partner