Prototype Multilayer Fr4 PCB with Customized PCB Service

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Model NO.: Okey-am-0523-28
• Base Material: Aluminum
• Insulation Materials: Organic Resin
• Model: PCB
• Color: Green, Blue, Black, Red, Yellow etc.
• Certificate: ISO UL RoHS and Reach
• Surface Finish: HASL
• Transport Package: Inner Vacuum Packing Outer Carton Box
• Specification: UL, Rohs, ISO9001: 2008
• Trademark: OKEY
• Origin: Shenzhen, Guangdong, China
• HS Code: 8534009000
• Production Capacity: Output 10 000 Square Meter Per Month

Product Description

Technical Capabilities
Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Max. Board size		2000×610mm
Min. board Thickness		2-layer 0.15mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
Min. line Width/Space		0.1mm(4mil)
Max. Copper thickness		10OZ
Min. S/M Pitch		0.1mm(4mil)
Min. hole size		0.2mm(8mil)
Hole dia. Tolerance (PTH)		±0.05mm(2mil)
Hole dia. Tolerance		,+0/-0.05mm(2mil)
Hole position deviation		±0.05mm(2mil)
Outline tolerance		±0.10mm(4mil)
Twist & Bent		0.75%
Insulation Resistance		>10 12 Ω Normal
Electric strength		>1.3kv/mm
S/M abrasion		>6H
Thermal stress		288°C 10Sec
Test Voltage		50-300V
Min. blind/buried via		0.15mm (6mil)
Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials		FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm

 

Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		08:01
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil
		Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

Pcb circuit board with double sided soldermask:

Top quality bare pcb with cheapest price made in China

1. PCB layer: 1-12 layers
2. PCB Certificate: ISO UL REACH and RoHS
3. FR-4 Material
4. Best price with excellent after-service
5. Reputable manufacturer

Hello, are you still looking for some manufactory to test your PCB circuit design?
We offer 3-6 workdays delivery time for make protoypes.
1. We have 10 years experience in circuit board, Printed Circuit Board field to serve your needs.
2. Competitive circuit board, Printed Circuit Board price with high quality.
3. Excellent service and prompt delivery
4. Our circuit board, Printed Circuit Board get ISO and UL Certificates and meet RoHS REACH standard
5. You can contact us at any time, we are 24-hour service for you!

NO	Item	Technical capabilities
1	Layers	1-12 layers
2	Max. Board size	2000×610mm
3	Min. board Thickness	2-layer  0.25mm
		4-layer  0.6mm
		6-layer  0.8mm
		8-layer  1.5mm
		10-layer  1.6~2.0mm
4	Min. line Width/Space	0.15mm(4-5mil)
5	Max. Copper thickness	10OZ
6	Min. S/M Pitch	0.15mm(4-5mil)
7	Min. hole size	0.2mm(8mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	>10 12 Ω Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.2mm  (8mil)
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base