| Customization: | Available |
|---|---|
| Structure: | Double-Sided Rigid PCB |
| Dielectric: | FR-4 |
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| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 08:01 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
Min trace width/space for outer layer |
4mil/4mil |
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| Tolerance of Etching | +/-10% | ||
Thickness of solder mask |
on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil | ||
| Finished thickness | |||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
Surface finish |
HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. |
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| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
| NO | Item | Technical capabilities |
| 1 | Layers | 1-12 layers |
| 2 | Max. Board size | 2000×610mm |
| 3 | Min. board Thickness | 2-layer 0.25mm |
| 4-layer 0.6mm | ||
| 6-layer 0.8mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.15mm(4-5mil) |
| 5 | Max. Copper thickness | 10OZ |
| 6 | Min. S/M Pitch | 0.15mm(4-5mil) |
| 7 | Min. hole size | 0.2mm(8mil) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
| 10 | Hole position deviation | ±0.05mm(2mil) |
| 11 | Outline tolerance | ±0.10mm(4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288°C10Sec |
| 17 | Test Voltage | 50-300V |
| 18 | Min. blind/buried via | 0.2mm (8mil) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materials | FR4,H-TG,Rogers,Ceramics,Aluminium, Copper base |
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