China Multilayer Fr-4 Blind Buried Hole Immersion Gold HDI PCB/Circuit Board PCB
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Product Details
| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
Diamond Member Since 2013
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Address
1 Floor, 2#Gong Ye Yi Road, Dawangshan, Shajing, Bao'an District, Shenzhen, Guangdong, ...
International Commercial Terms(Incoterms)
FOB, EXW, CFR, CIF
Terms of Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
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Basic Info.
- Model NO.
- okey17
- Material
- Fiberglass Epoxy
- Flame Retardant Properties
- HB
- Mechanical Rigid
- Rigid
- Processing Technology
- Electrolytic Foil
- Base Material
- Aluminum
- Insulation Materials
- Organic Resin
- Model
- PCB
- Transport Package
- Inner Vacuum Packing Outer Cartons
- Specification
- UL ISO RoHS, REACH
- Trademark
- OKEY
- Origin
- Guangdong Shenzhen, China
- HS Code
- 85340090
- Production Capacity
- Output 10 000 Square Meter Per Month
Product Description
| Technical Capabilities | |||
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Max. Board size | 2000×610mm | ||
Min. board Thickness |
2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1mm(4mil) | ||
| Max. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1mm(4mil) | ||
| Min. hole size | 0.2mm(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300V | ||
| Min. blind/buried via | 0.15mm (6mil) | ||
Surface Finished |
HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
Materials |
FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control |
±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
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