Electronic Cigarette Pd65W PCBA Prototype Double Sided Fr4 PCB with Customized PCB Service

• Structure: Single-Sided Rigid PCB
• Dielectric: FR-4
• Material: Polyester Glass Fiber Mat Laminate
• Application: Consumer Electronics
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Model NO.: OKey-am-0008
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Organic Resin
• Brand: Okey
• Color: Green
• Transport Package: Inner Vacuum Bubble Bag Packing, Outer Carton Box
• Specification: UL, Rohs, ISO9001: 2008
• Trademark: Okey
• Origin: Shenzhen Guangdong China
• HS Code: 85340090
• Production Capacity: 20000 Sq Per Month

Product Description

Technical Capabilities
Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Max. Board size		2000×610mm
Min. board Thickness		2-layer 0.15mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
Min. line Width/Space		0.1mm(4mil)
Max. Copper thickness		10OZ
Min. S/M Pitch		0.1mm(4mil)
Min. hole size		0.2mm(8mil)
Hole dia. Tolerance (PTH)		±0.05mm(2mil)
Hole dia. Tolerance		,+0/-0.05mm(2mil)
Hole position deviation		±0.05mm(2mil)
Outline tolerance		±0.10mm(4mil)
Twist & Bent		0.75%
Insulation Resistance		>10 12 Ω Normal
Electric strength		>1.3kv/mm
S/M abrasion		>6H
Thermal stress		288°C 10Sec
Test Voltage		50-300V
Min. blind/buried via		0.15mm (6mil)
Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials		FR4,H- TG,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm

NPTH single sided printed circuit board:
1)Material: FR4
2)Layer: 1
3)Surface treatment: Immersion gold
4)Copper thickness: 1OZ
5)Board thickness: 1.6mm
6)High qualty with UL&Rohs
7)Timely delivery

NO	ITEM	Technical capabilities
1	Layers	1-10 layers
2	Max. Board size	2000×610mm
3	Min. board Thickness	2-layer  0.15mm
		4-layer  0.4mm
		6-layer  0.6mm
		8-layer  1.5mm
		10-layer  1.6~2.0mm
4	Min. line Width/Space	0.1mm(4mil)
5	Max. Copper thickness	10 OZ
6	Min. S/M Pitch	0.1mm(4mil)
7	Min. hole size	0.2mm(8mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	>10 12  Ω Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C 10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.2mm  (6mil)
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4,H-TG,Rogers,Ceramics,Aluminium, Copper base