PCB Drilling Machine High Precision Custom Printed Circuit Boards Single Double Multilayer USB Aux-in Audio PCB

• Type: Rigid Circuit Board
• Flame Retardant Properties: V0
• Dielectric: Copper Based PCB
• Base Material: Aluminum
• Insulation Materials: Organic Resin
• Processing Technology: Electrolytic Foil
• Model NO.: okey
• Application: Consumer Electronics
• Mechanical Rigid: Rigid
• Material: Copper-Based
• Brand: Okey
• Certificate: ISO UL RoHS and Reach
• Small Order: Accept
• Board Thickness: 2.5mm Copper Based
• Transport Package: Inner Vacuum Packing Outer Carton Box
• Specification: Copper, 1.6mm, single-sided
• Trademark: OKEY
• Origin: Guangdong Shenzhen, China
• HS Code: 8534009000
• Production Capacity: Output 20 000 Square Meter Per Month

Product Description

Technical Capabilities
Items				Speci.		Remark
Max panel size				32" x 20.5"(800mm x 520mm)
Max. Board size				2000×610mm
Min. board Thickness				2-layer 0.15mm
				4-layer 0.4mm
				6-layer 0.6mm
				8-layer 1.5mm
				10-layer 1.6~2.0mm
Min. line Width/Space				0.1mm(4mil)
Max. Copper thickness				10OZ
Min. S/M Pitch				0.1mm(4mil)
Min. hole size				0.2mm(8mil)
Hole dia. Tolerance (PTH)				±0.05mm(2mil)
Hole dia. Tolerance				,+0/-0.05mm(2mil)
Hole position deviation				±0.05mm(2mil)
Outline tolerance				±0.10mm(4mil)
Twist & Bent				0.75%
Insulation Resistance				>10 12 Ω Normal
Electric strength				>1.3kv/mm
S/M abrasion				>6H
Thermal stress				288°C 10Sec
Test Voltage				50-300V
Min. blind/buried via				0.15mm (6mil)
Surface Finished				HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials				FR4,H-TG,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)				4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)				5 mil(0.13mm)		hole ring width
Min thickness(inner layer)				4 mil(0.1mm)		without copper
Inner copper thickness				1~4 oz
Outer copper thickness				0.5~6 oz
Finished board thickness				0.4-3.2 mm
Board thickness tolerance control		±0.10 mm		±0.10 mm		1~4 L
		±10%		±10%		6~8 L
		±10%		±10%		≥10 L
Inner layer treatment				brown oxidation
Layer count Capability				1-30 LAYER
alignment between ML				±2mil
Min drilling				0.15 mm
Min finished hole				0.1 mm
Hole precision			±2 mil(±50 um)
tolerance for Slot			±3 mil(±75 um)
tolerance for PTH			±3 mil(±75um)
tolerance for NPTH			±2mil(±50um)
Max Aspect Ratio for PTH			08:01
Hole wall copper thickness			15-50um
Alignment of outer layers			4mil/4mil
Min trace width/space for outer layer			4mil/4mil
Tolerance of Etching			+/-10%
Thickness of solder mask	on trace		0.4-1.2mil(10-30um)
	at trace corner		≥0.2mil(5um)
	On base material		≤+1.2mil
			Finished thickness
Hardness of solder mask			6H
Alignment of solder mask film			±2mil(+/-50um)
Min width of solder mask bridge			4mil(100um)
Max hole with solder plug			0.5mm
Surface finish			HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger			280u"(7um)
Max gold thickness for Gold finger			30u"(0.75um)
Nickel thickness in Immersion Gold			120u"/240u"(3um/6um)
Gold thickness in Immersion Gold			2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance			50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength			≥61B/in(≥107g/mm)
bow and twist			0.75%