Electronic Circuit Board Manufacturer Custom Assembly One-Stop Service PCB PCBA

• Metal Coating: Copper
• Mode of Production: SMT
• Layers: Multilayer
• Base Material: FR-4
• Certification: RoHS, CCC, ISO, UL
• Customized: Customized
• Model NO.: PCBA
• Condition: New
• Type: Printed Circuit Board Flexible Circuit Board
• Material: Aluminum Covered Copper Foil Layer
• Product Name: PCBA
• Transport Package: Inner Vacuum Package Outer Carton
• Specification: Customized
• Trademark: Okey
• Origin: Shenzhen
• HS Code: 85340090
• Production Capacity: 100000pieces/Year

Product Description

Items		Speci.
Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)
Min thickness(inner layer)		4 mil(0.1mm)
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm
	±10%	±10%
	±10%	±10%
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		08:01
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil
		Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

 

NO	Item	Technical capabilities
1	Layers	1-20 layers
2	Max. Board size	2000×610mm
3	Min. board Thickness	2-layer  0.15mm
		4-layer  0.4mm
		6-layer  0.6mm
		8-layer  1.5mm
		10-layer  1.6~2.0mm
4	Min. line Width/Space	0.1mm(4mil)
5	Max. Copper thickness	10OZ
6	Min. S/M Pitch	0.1mm(4mil)
7	Min. hole size	0.2mm(8mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	>10 12 Ω Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C 10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.15mm  (6mil)
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base

PCB Assembly capability

Full SMT line for single or double sided assemblies
SMT component placement in as small as 0201 size
BGA placement down to 0.35mm
Over 115000 solder joints per hour average SMT capability
PCB handling size from 2"*2cm" up to 20"*18cm"
12 zones(10 heated zones, 2cooling zones)reflow oven with extensive profiling capabilities and lead-free reflow
Automated solder paste screening
Automated optical inspection(AOI)system for fault finding on finished assemblies
Various manual optical inspection
Full equipped DIP(PTH assembly)line
Lead-free capabilities



           

OUR COMPANY