Customization: | Available |
---|---|
Type: | Combining Rigid Circuit Board |
Flame Retardant Properties: | V2 |
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PCB Item
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Standard
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Advanced
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Layer Counts:
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1L--10L, HDI
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10L-18L,HDI
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Base Material:
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CAM1,FR4,F4BK,Arlon
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Material Suppliers:
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GUOJI(GDM), KINGBOARD(KB), SHENGYI,Arlon
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Material Thickness(mm):
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0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
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Max board size(mm):
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1200x400mm
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1200x500mm
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Board Outline Tolerance:
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±0.15mm
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±0.01mm
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Board Thickness:
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0.4mm--3.2mm
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0.3mm----3.2mm
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Thickness Tolerance:
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±8%
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±5%
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Minimum line/space:
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0.1mm
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Mini Hole Size(mechanical):
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0.2mm
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Innerlayer Copper Weight:
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0.1mm
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Innerlayer Copper Weight:
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17um--105um
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Outlayer Copper Weight:
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17um--105um
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Mini Solder Mask Bridge:
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0.05mm
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Impedance Control Tolerance:
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±10%
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Contours:
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Scored, Routed, Punched
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Surface Finishing:
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HAL,lead-free HAL,ENIG,Plated Gold,Immersion Silver,OSP
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1--2L Lead Time:
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3-7 days
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4--18L Lead Time:
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7-10 days
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Acceptable File Format:
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Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
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Quality Standards:
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IPC-A-600H Class2
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Certificate:
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ISO9001:2008,PCB Assembly Capability
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Stencil Size:
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736x736mm
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Minimum IC Pitch:
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0.2mm
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Maximum PCB size:
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1200x 500mm
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Minimum PCB thickness:
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0.25mm
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Minimum chip size:
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0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
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Maximum BGA size:
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74x74mm
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BGA ball pitch:
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1.00mm (minimum), 3.00mm (maximum)
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BGA ball diameter:
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0.40mm (minimum), 1.00mm (maximum)
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QFP lead pitch:
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0.38mm (minimum), 2.54mm (maximum)
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Volume:
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One piece to low volume production quantities Low cost first article builds Schedule deliveries |
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Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly |
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Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
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Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type:
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Leaded Lead-free/ROHS compliant |
Other capabilities:
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Repair/rework services Mechanical assembly Box build Mold and plastic injection. |