Multi-Layer PCB/PCBA Design and Engineering Services

Product Details
Customization: Available
Type: Rigid Circuit Board
Flame Retardant Properties: V0
Still deciding? Get samples of US$ 0.5/Piece
Request Sample
Manufacturer/Factory

360° Virtual Tour

Diamond Member Since 2013

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Registered Capital
2000000 RMB
Plant Area
>2000 square meters
  • Multi-Layer PCB/PCBA Design and Engineering Services
  • Multi-Layer PCB/PCBA Design and Engineering Services
  • Multi-Layer PCB/PCBA Design and Engineering Services
  • Multi-Layer PCB/PCBA Design and Engineering Services
  • Multi-Layer PCB/PCBA Design and Engineering Services
  • Multi-Layer PCB/PCBA Design and Engineering Services
Find Similar Products

Basic Info.

Model NO.
Okey-am-088
Dielectric
FR-4
Base Material
Copper
Insulation Materials
Organic Resin
Processing Technology
Electrolytic Foil
Application
Consumer Electronics
Mechanical Rigid
Rigid
Material
Fr4
Color
Green, Blue, Black, Red, Yellow etc.
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
UL ISO RoHS, REACH
Trademark
OKEY
Origin
Guangdong Shenzhen, China
HS Code
8534009000
Production Capacity
20 000 Square Meters Per Month

Product Description

Multi-Layer PCB/PCBA Design and Engineering Services
Multi-Layer PCB/PCBA Design and Engineering Services
Multi-Layer PCB/PCBA Design and Engineering Services
Multi-Layer PCB/PCBA Design and Engineering Services
Multi-Layer PCB/PCBA Design and Engineering ServicesMulti-Layer PCB/PCBA Design and Engineering Services
Technical Capabilities
Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)  
Max. Board size 2000×610mm  


Min. board Thickness
2-layer 0.15mm  
4-layer 0.4mm  
6-layer 0.6mm  
8-layer 1.5mm  
10-layer 1.6~2.0mm  
Min. line Width/Space 0.1mm(4mil)  
Max. Copper thickness 10OZ  
Min. S/M Pitch 0.1mm(4mil)  
Min. hole size 0.2mm(8mil)  
Hole dia. Tolerance (PTH) ±0.05mm(2mil)  
Hole dia. Tolerance ,+0/-0.05mm(2mil)  
Hole position deviation ±0.05mm(2mil)  
Outline tolerance ±0.10mm(4mil)  
Twist & Bent 0.75%  
Insulation Resistance >10 12 Ω Normal  
Electric strength >1.3kv/mm  
S/M abrasion >6H  
Thermal stress 288°C 10Sec  
Test Voltage 50-300V  
Min. blind/buried via 0.15mm (6mil)  

Surface Finished
HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold  

Materials
FR4,H-
TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
 
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control
±0.10 mm ±0.10 mm
1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1-30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  

Multi-Layer PCB/PCBA Design and Engineering Services
Multi-Layer PCB/PCBA Design and Engineering Services
Multi-Layer PCB/PCBA Design and Engineering Services

Multi-Layer PCB/PCBA Design and Engineering Services

Double sided pcb board with osp finish:
Place of Origin Guangdong, China (Mainland)
Brand Name OKEY
Model Number okey pcb
Base Material FR-4
Copper Thickness 1 OZ
Board Thickness 1.2 mm
Min. Hole Size 0.4mm
Min. Line Width 0.2mm
Min. Line Spacing 0.15mm
Surface Finishing HASL
Color red
Small order acceptable
Fire resistanceUL-94V0
Outline/contourmilling, V-cut, CNC Routing
100% productsE-test or flying probe test

Features

Thin board capabilities
Increase routing density in complicated desig
Excellent mounting stability and reliability
Qualified material and surface treatment for Lead-free process

Applications

Smartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD Module

Benefits

Well experienced manufacturer with good yiel
Multiple plants increase production output in short time
NO Item Technical capabilities
1 Layers 1-20 layers
2 Max. Board size 2000×610mm
3 Min. board Thickness 2-layer  0.15mm
4-layer  0.4mm
6-layer  0.6mm
8-layer  1.5mm
10-layer  1.6~2.0mm
4 Min. line Width/Space 0.1mm(4mil)
5 Max. Copper thickness 10OZ
6 Min. S/M Pitch 0.1mm(4mil)
7 Min. hole size 0.2mm(8mil)
8 Hole dia. Tolerance (PTH) ±0.05mm(2mil)
9 Hole dia. Tolerance (NPTH) +0/-0.05mm(2mil)
10 Hole position deviation ±0.05mm(2mil)
11 Outline tolerance ±0.10mm(4mil)
12 Twist & Bent 0.75%
13 Insulation Resistance >10 12 Ω Normal
14 Electric strength >1.3kv/mm
15 S/M abrasion >6H
16 Thermal stress 288°C 10Sec
17 Test Voltage 50-300V
18 Min. blind/buried via 0.15mm  (6mil)
19 Surface Finished HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20 Materials FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier