Customized PCB PCBA Electronic Board Assembly

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: OKEY PCBA
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: FR-4
• Brand: Okey PCBA
• Application: Electronic Products
• Customized: Customizable
• Quality Standard: Ipc 610 Class II
• Certificate: RoHS, SGS, Reach, UL, ISO 9000, ISO 14000
• Board Thickness: 0.4-2.0mm
• Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig
• Lead Time: 6-8 Workdays
• Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple
• Silkscreen Color: Green, White, Black, Blue, Yellow
• Copper Thickness: 0.5-4 Oz
• Layer: 1-20 Layers
• Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base, Teflon
• PCB Testing: E-Test, Fly Probe Test, Visual Checking
• PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test
• Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment
• Transport Package: Inner Vaccun Outer Carton
• Specification: 330*260*210mm
• Trademark: OKEY PCBA
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 20 000 Square Meters Per Month

Product Description

Our Products:




PCB&PCBA Capabilities:

SHENZHEN OKEY CIRCUIT CO.,LTD
PCB Manufacturing Capabilities:
Layers	1-20 Layers
Laminate	FR4, H-TG, CEM, Aluminum, Copper Base, Teflon, Rogers,
	Ceramics, Iron Base
Max. Board Size	1200*480mm
Min.Board Thickness	2-Layer 0.15mm
	4-Layer 0.4mm
	6-Layer 0.6mm
	8-Layer 1.5mm
	10-Layer 1.6-2.0mm
Min. Line Width/Trace	0.1mm(4mil)
Max. Copper Thickness	10 OZ
Min. S/M Pitch	0.1mm(4mil)
Max. S/M Pitch	0.2mm(8mil)
Min. Hole Dia.	0.2mm(8mil)
Hole Dia. Tolerance(PTH)	±0.05mm(2mil)
Hole Dia. Tolerance(NPTH)	±0.05mm(2mil)
Hole Position Deviation	±0.05mm(2mil)
Outline Tolerance	±0.1mm(4mil)
Twist/Bent	0.75%
Insulation Resistance	>1012Ω Normal
Electric Strength	>1.3kv/mm
S/M Abrasion	>6H
Thermal Stress	288ºC 10Sec
Test Voltage	50-300V
Min. Blind/Buried Via	0.15mm(6mil)
Surface Treatment	OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver,
	Ag/Silver Plating,Immersion Tin,Tin Plating
Testing	E-test, Fly probe test
PCB Assembly Manufacturing Capabilities:
Type of Assembly	SMT (Surface-Mount Technology)
	DIP (Dual Inline-pin Package)
	SMT & DIP mixed
	Double-sided SMT and DIP assembly
Solder Type	Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS)
Components	Passives parts, smallest size 0201
	BGA, uBGA, QFN, SOP, TTSOP, and Leadless chips
	Fine Pitch to 0.8Mils
	BGA Repair and Reball, Part Removal and Replacement
	Connectors and Terminals
Bare Board Size	Smallest:0.25''x 0.25'' (6.35mm x 6.35mm)
	Largest: 20'' x 20'' (508mm x 508mm)
	Largest LED PCB: 47'' x 39'' (1200mm x 480mm)
Min. IC Pitch	0.012'' (0.3mm)
QFN Lead Pitch	0.012'' (0.3mm)
Max. BGA size	2.90'' x 2.90'' (74mm x 74mm)
Testing	X-ray Inspection
	AOI (Automated Optical Inspection)
	ICT (In-Circuit Test)/Functional Testing
Component Packaging	Reels, cut tape, Tube and tray, Loose parts and bulk

Quality Compare:








Production  Equipment: