Fr4 PCB Board Lead Free HASL Customized OEM PCBA Factory

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fr4
• Flame Retardant Properties: HB
• Color: Green, White
• Transport Package: Inner Vacuum Packed Outside in Carton
• Model NO.: okey
• Specification: UL ISO RoHS, REACH
• Trademark: OKEY
• Origin: Guangdong Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20 000 Square Meters Per Month

Product Description

Technical Capabilities
Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Max. Board size		2000×610mm
Min. board Thickness		2-layer 0.15mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
Min. line Width/Space		0.1mm(4mil)
Max. Copper thickness		10OZ
Min. S/M Pitch		0.1mm(4mil)
Min. hole size		0.2mm(8mil)
Hole dia. Tolerance (PTH)		±0.05mm(2mil)
Hole dia. Tolerance		,+0/-0.05mm(2mil)
Hole position deviation		±0.05mm(2mil)
Outline tolerance		±0.10mm(4mil)
Twist & Bent		0.75%
Insulation Resistance		>10 12 Ω Normal
Electric strength		>1.3kv/mm
S/M abrasion		>6H
Thermal stress		288°C 10Sec
Test Voltage		50-300V
Min. blind/buried via		0.15mm (6mil)
Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials		FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm

FR4 PCB board with Lead Free HASL


1. Reputable manufacturer
2. Certificate: ISO UL ROHS REACH
3. FR-4 PCB
4. Timely delivery
5. Reputable manufacturer

Place of OriginGuangdong, China (Mainland)
Brand Nameokey
Base MaterialFR4
Copper Thickness0.5 OZ
Board Thickness1.5mm
Min. Hole Size0.2mm
Min. Line Width0.1mm
Min. Line Spacing0.1mm
Surface FinishingHASL
Colorgreen mask, white legend

NO	I tem	Technical capabilities
1	Layers	1-20 layers
2	Max. Board size	2000×610mm
3	Min. board Thickness	2-layer  0.15mm
		4-layer  0.4mm
		6-layer  0.6mm
		8-layer  1.5mm
		10-layer  1.6~2.0mm
4	Min. line Width/Space	0.1mm(4mil)
5	Max. Copper thickness	10OZ
6	Min. S/M Pitch	0.1mm(4mil)
7	Min. hole size	0.2mm(8mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	>10 12  Ω Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C 10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.15mm  (6mil)
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base