Circuit Board Air Conditioner Remote Control Smart Plug Motherboard Phone PCB

• Customization: Available
• Type: Combining Rigid Circuit Board
• Flame Retardant Properties: V2
• Model NO.: Okey-001
• Dielectric: FR-4
• Base Material: Copper
• Insulation Materials: Metal Composite Materials
• Processing Technology: Electrolytic Foil
• Application: Consumer Electronics
• Mechanical Rigid: Rigid
• Material: Paper Phenolic Copper Foil Substrate
• Brand: OEM ODM
• Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg
• Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG
• Layer: 1-60 Layers
• Service: Turnkey Assembly PCB Service
• Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui
• Transport Package: Inner Vacuum Packing Outer Carton Box
• Specification: FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
• Trademark: OKEY/ODM OEM
• Origin: China
• HS Code: 8534009000
• Production Capacity: Output 10 000 Square Meter Per Month

Product Description

Our one-stop service:
1. PCB development and design;
2. PCB manufacturing from 1 to 32 layers(Rigid PCB,Flexible PCB,Ceramci PCB,Aluminum PCB);
3. PCB Clone;
4. Component sourcing;
5. PCB Assembly;
6. Write program for customers;
7. PCB/ PCBA Test.
8. Contract Manufacturing  
9.  Engineering Services  
10. Component Procurement & Material Management  
11. Product Design  
12.Fast Track Prototyping  
13.Cable and Wire Assemblies
14.Plastics and Molds  
15.  Function Testing Service

Our Advantage: 
1. Free programming and free functional test, free package. 
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% funtional test. 
3. Professional service. ISO SMT and through hole assembly, over 12 years experience.
4. Certification for electronics: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001:2008, ISO14001.
5. 24 hours online service.

PCB Production Capacity:

PCB Item	Standard	Advanced
Layer Counts:	1L--10L, HDI	10L-18L,HDI
Base Material:	CAM1,FR4,F4BK,Arlon
Material Suppliers:	GUOJI(GDM), KINGBOARD(KB), SHENGYI,Arlon
Material Thickness(mm):	0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
Max board size(mm):	1200x400mm	1200x500mm
Board Outline Tolerance:	±0.15mm	±0.01mm
Board Thickness:	0.4mm--3.2mm	0.3mm----3.2mm
Thickness Tolerance:	±8%	±5%
Minimum line/space:	0.1mm
Mini Hole Size(mechanical):	0.2mm
Innerlayer Copper Weight:	0.1mm
Innerlayer Copper Weight:	17um--105um
Outlayer Copper Weight:	17um--105um
Mini Solder Mask Bridge:	0.05mm
Impedance Control Tolerance:	±10%
Contours:	Scored, Routed, Punched
Surface Finishing:	HAL,lead-free HAL,ENIG,Plated Gold,Immersion Silver,OSP
1--2L Lead Time:	3-7 days
4--18L Lead Time:	7-10 days
Acceptable File Format:	Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
Quality Standards:	IPC-A-600H Class2
Certificate:	ISO9001:2008,PCB Assembly Capability

PCB Assembly Capability:

Stencil Size:	736x736mm
Minimum IC Pitch:	0.2mm
Maximum PCB size:	1200x 500mm
Minimum PCB thickness:	0.25mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Volume:	One piece to low volume production quantities Low cost first article builds Schedule deliveries
Assembly type:	Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly
Components type:	Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Parts procurements:	Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder type:	Leaded Lead-free/ROHS compliant
Other capabilities:	Repair/rework services Mechanical assembly Box build Mold and plastic injection.