Technical Capabilities
Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Max. Board size		2000×610mm
Min. board Thickness		2-layer 0.15mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
Min. line Width/Space		0.1mm(4mil)
Max. Copper thickness		10OZ
Min. S/M Pitch		0.1mm(4mil)
Min. hole size		0.2mm(8mil)
Hole dia. Tolerance (PTH)		±0.05mm(2mil)
Hole dia. Tolerance		,+0/-0.05mm(2mil)
Hole position deviation		±0.05mm(2mil)
Outline tolerance		±0.10mm(4mil)
Twist & Bent		0.75%
Insulation Resistance		>10 12 Ω Normal
Electric strength		>1.3kv/mm
S/M abrasion		>6H
Thermal stress		288°C 10Sec
Test Voltage		50-300V
Min. blind/buried via		0.15mm (6mil)
Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials		FR4,H- TG,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm

Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		08:01
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil
		Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

NO	Item	Technical capabilities
1	Layers	1-20 layers
2	Max. Board size	2000× 610mm
3	Min. board Thickness	2-layer 0.25mm
		4-layer 0.6mm
		6-layer 0.8mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
4	Min. line Width/Space	0.15mm(4mil)
5	Max. Copper thickness	10OZ
6	Min. S/M Pitch	0.1mm(4mil)
7	Min. hole size	0.25mm(8mil)
8	Hole dia. Tolerance (PTH)	± 0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	± 0.05mm(2mil)
11	Outline tolerance	± 0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	> 10 12 Ω Normal
14	Electric strength	> 1.3kv/mm
15	S/M abrasion	> 6H
16	Thermal stress	288° C10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.2mm
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4, H-TG, Rogers, Ceramics, Aluminium, Copper base

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